WEZD5
LBNL, Berkeley, California, USA
Cornell University, Ithaca, New York, USA
FRIB, East Lansing, Michigan, USA
We report on the development of multi-beam radio frequency (RF) linear ion accelerators that are formed from stacks of low-cost printed circuit boards. An array of 112 beamlets is formed using MEMS techniques in 4" wafers. The peak argon ion current accelerated in the 112-beamlet column to date is 0.5 mA [1]. We have accelerated ions in stacks of 32 wafers to an energy of 100 keV. The measured energy gain in each RF gap reached 6.5 keV on average, resulting in an effective acceleration gradient of 0.4 MV/m. We will describe how this approach to multi-beam RF ion acceleration can scale to high beam power for applications in material processing and nuclear materials development.
[1] Qing Ji, et al., "Beam power scale-up in micro-electromechanical systems based multi-beam ion accelerators", Rev. Sci. Instr. 92, 103301 (2021); https://doi.org/10.1063/5.0058175
