Author: Houlahan, T.J.
Paper Title Page
MOPA61 Modular Solid-State Switching and Arc Suppression for Vacuum Tube Bias Circuits 179
  • E.L. Atkinson, T.J. Houlahan, B.E. Jurczyk, R.A. Stubbers
    Starfire Industries LLC, Champaign, USA
  In this work, we present operational and performance data for a solid-state switching circuit that delivers pulsed power at up to 12 kV and 100 A. This circuit, which is comprised of a series configuration of IGBT-based subcircuits, is suitable for driving the high-power vacuum-tube amplifiers that are typically used in RF accelerator systems. Each subcircuit can switch up to 3 kV, and the subcircuits can be stacked in series to extend the overall voltage capabilities of the switch. The circuit is designed to prevent overvoltaging any single transistor during switching transients or faults, regardless of the number of series subcircuits. Further, the circuit also includes the capability for rapid arc detection and suppression. Testing has shown effective switching at up to 100 A at 12 kV and for pulse repetition frequencies and durations in the range of 1-200 Hz and 10-50 µs, respectively. Additionally, the arc suppression circuitry has been shown to reliably limit arcs at 8-12 kV with a quench time of <1 µs and with a total energy of <0.2 J, minimizing the grid erosion in the vacuum-tube during an arc.  
DOI • reference for this paper ※ doi:10.18429/JACoW-NAPAC2022-MOPA61  
About • Received ※ 01 August 2022 — Revised ※ 09 August 2022 — Accepted ※ 20 August 2022 — Issue date ※ 10 September 2022
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MOPA62 High Quality Conformal Coatings on Accelerator Components via Novel Radial Magnetron with High-Power Impulse Magnetron Sputtering 182
  • W.M. Huber, I. Haehnlein, T.J. Houlahan, B.E. Jurczyk, A.S. Morrice, R.A. Stubbers
    Starfire Industries LLC, Champaign, USA
  Funding: This material is based upon work supported by the U.S. Department of Energy under Award Numbers DE-SC0019784 and DE-SC0020481.
In this work, we present two configurations of a novel radial magnetron design that are suitable for coating the complex inner surfaces of a variety of modern particle accelerator components. These devices have been used in conjunction with high-power impulse magnetron sputtering (HiPIMS) to deposit copper and niobium films onto the inner surfaces of bellows assemblies, waveguides, and SRF cavities. These films, with thicknesses of up to 3 µm and 40 µm for niobium and copper, respectively, have been shown to be conformal, adherent, and conductive. In the case of copper, the post-bake RRR values of the resulting films are well within the range specified for electroplating of the LCLS-II bellows and CEBAF waveguide assemblies. In addition to requiring no chemical processing beyond a detergent rinse and solvent degrease, this magnetron design exhibits over 80% target material utilization. Further, in the case of niobium, an enhancement in RRR over that of the bulk (target) material has been observed.
DOI • reference for this paper ※ doi:10.18429/JACoW-NAPAC2022-MOPA62  
About • Received ※ 02 August 2022 — Revised ※ 05 August 2022 — Accepted ※ 09 August 2022 — Issue date ※ 21 August 2022
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